Home page
We are here
Our Products
Optronic products
RF receiving products
Memory products
Custom design products
Power protectors
RF switch drivers
Elisra Microelectronics has extensive experience in the design and manufacture of dense and complex packaging solutions which have supported countless defense missions and demanding commercial applications.

Elisra's modern facility, variety of in house technologies, and vast experience with complex solutions are the key factors in providing on-time optimum solution at affordable prices.

Substrate TechnologiesTechnology and Engineering Picture No. 1

  • Thick film
  • Thin film
  • Photo imageable thick film
  • HTCC
  • LTCC

Assembly Techniques

  • SMT
  • Chip & Wire
  • Mixed Technology
  • Chip on Board (COB)

Design ToolsTechnology and Engineering Picture No. 2

  • AutoCAD for mechanical design
  • Viewlogic schematic capture
  • VISULA high speed MCM Design Suite including thermal analysis features
  • PSpice and Harmonica for DC, AC transient analysis

Manufacturing Equipment

  • Thick film printing and firing equipment
  • Well equipped yellow room for thin film processing
  • Resistor laser trimmer
  • Automatic assembly system
  • Automatic ball bonder
  • Automatic wedge bonder
  • Heavy wire bonder
  • Seam sealer for sealing hermetic packages

Test Capabilities

  • PC-controlled GPIB testers
  • Automatic high speed digital tester, ATS-1 Blazer
  • Vector analyzer
  • Digital scope 10GS/sec.
  • 0.1 to 40 GHz RF measurements 
Home Contact Us About us Products Capabilities News
RF Receiving Memory Modules Optronics RF Switch Drivers Custom Power Protectors