MCMs:
Elisra Microelectronics has extensive experience in the design
and manufacture of dense and complex multichip modules based on high-temperature cofired ceramic and photo
imageable thin and thick film technologies.
Mechanical interconnections are thru hole or surface mount
assembly.
Main features
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Very high density multilayer ceramic packages
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Variety of customized shapes
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Excellent thermal behavior
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Controlled impedance transmission lines
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Excellent signal integrity
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In-house design and manufacture
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Functional and parametric testing capability
Some MCMs which were designed and manufactured
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High frequency DSP MCM
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sample rate: 500Mhz
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power consumption: 30 watt
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dimensions: 4" x 2"
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interconnection: 240 pin I/O, cavity up PGA
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technology: HTCC
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High frequency 8 bit digitizer MCM
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sample rate: 1000Mhz
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RF input: 500Mhz
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power consumption: 15 watt
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dimensions: 2" x 2.3"
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interconnection: 196 pin I/O, gullwing SMT + 3 GPO connectors
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technology: photo imageable gold
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Memory bank MCM with G/A for decoding
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content: SRAM, flash, EEPROM, logic & decoding, UART, oscillator
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power consumption: 10 watt
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dimensions: 2.6" x 2.6"
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mechanical configuration: 258 pin I/O, cavity down PGA
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technology: HTCC
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Subsystems:
Elisra Microelectronics offers a wide range of complex
subsystems and subassemblies that integrate its most advanced DLVAs, Log IF amplifiers and FM
discriminators building blocks in the IF & RF frequency range together with sophisticated MCM packaging
and fast signal processing technologies.
7 Channel Fast Detection Subsystem
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7 DLVA channels
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Detection of greatest: 0.5 to 18GHz frequency range
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Fast, 50nsec pulse processing
Video Processing Subsystem
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30 to 60 MHz input IF signal
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Video, telemetry & AM signal output
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Integral Logarithmic IF amplifier, FM discriminator, filtering
circuitry
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Chip On Board (COB)
COB Solutions
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COB on FR4/Glass Epoxy
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COB on alumina/ceramic
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Assembly of die ASICs and passive components
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Mix of SMT & COB as required
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MCM - Multi Chip Modules
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Flip Chip assembly
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COB Assembly & Testing Capabilities
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Automatic Aluminum Wedge Bonding
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Automatic Gold Ball Bonding
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Epoxy or eutectic die attach
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Encapsulation or Glob Top as required
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Wire bond pull test
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Die bond shear test
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RF and digital electrical testing
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